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US 2025/0029901 A1Published application
Compact direct-bonded metal substrate package
AssigneeSemiconductor Components Industries, LLC
InventorsSilnore Tejero SABANDO, Chee Hiong CHEW
Life of this patent
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Abstract
A compact power inverter is efficiently laid out on a multi-layer direct bond metal (DBM) structure, having a reduced footprint and straight, short-run wire bonds. The compact layout reduces an amount of material needed to fabricate a multi-layer DBM that includes a silicon nitride ceramic layer. The layout is further designed so that wire bonds can be routed without bending around corners. The compact DBM structure and short wire bonds provide a solution that is both low-cost and highly reliable.
Claims20
An apparatus, comprising:
- a lead frame having a gate lead frame post, a sense lead frame post, and a ground connection;
- a direct bond metal (DBM) structure including an insulating layer;
- a first die and a second die attached side-by-side to the DBM structure;
- a metal clip having a first tab coupling a top side of the first die and having a second tab coupling a top side of the second die to the lead frame using solder;
- and
- an electrical connection coupling a gate terminal of the first die directly to the gate lead frame post.
3 more elements
An apparatus, comprising:
- a lead frame portion;
- a direct bond metal (DBM) structure, the DBM structure including a first metal layer, a second metal layer, and a ceramic layer disposed between the first metal layer and the second metal layer,
- a first die and a second die attached side-by-side to a die attach pad of the DBM structure;
- a U-shaped metal clip having a first tab coupled to a top side of the first die and having a second tab coupled to a top side of the second die, the U-shaped metal clip coupled to the lead frame portion;
- and
- wire bonds including:
- a first wire bond coupling a gate terminal of the first die to a gate terminal of the second die, and
- a second wire bond coupling the second die to a gate pad.
5 more elements
A method, comprising:
- coupling back sides of a first die and a second die to a direct bond metal (DBM) structure;
- forming a lead frame and a metal clip;
- coupling the DBM structure to a substrate;
- coupling the metal clip between top sides of the first die and the second die and a ground plate of the lead frame;
- coupling a gate terminal of the first die and a gate terminal of the second die to a first lead frame post;
- and
- coupling a sense terminal of the second die to a second lead frame post.
4 more elements
Dependencies are inferred from the claim text.