Glass core package substrates

A method comprising:

• fabricating a first glass package substrate;
• forming redistribution layers between a first integrated circuit and a first side of a first glass wafer of the first glass package substrate;
• and
• forming bump pads between a motherboard and a second side different than the first side of the first glass wafer;
• wherein responsive to a potential being applied to a first node of one of the integrated circuit and a component on the motherboard, conveying a current from the first node to a second node through the first glass package substrate.

A computing system comprising:

• a memory on a printed circuit board configured to store instructions of one or more tasks;
• and
• a processing unit in a chip package coupled to the memory through an apparatus, wherein the apparatus comprises:
• a first integrated circuit coupled to a first glass package substrate comprising:
• redistribution layers between the first integrated circuit and a first side of a first glass wafer;
• and
• bump pads between the printed circuit board and a second side different than the first side of the first glass wafer;
• and
• wherein responsive to a potential being applied to a first node of one of the processing unit and the memory, a current is conveyed from the first node to a second node through the first glass package substrate.