Integrated circuit systems cooled by embedded microtubes

Abstract

An integrated circuit unit comprises at least one electronic chip consisting of a wafer body including at least one groove extending along its surface from one end to the other, and of an active area; the integrated circuit unit further comprises at least one tube, which is housed in the groove therein, and which allows the transport of a fluid for cooling the electronic chips. A three-dimensional stack-type integrated circuit system comprises two integrated circuit units and a three-dimensional stack-type integrated circuit system comprising more than two integrated circuit units.

Dependencies are inferred from the claim text.