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US 2025/0029888 A1Published application
Customized heat dissipation from different types of integrated circuit dies packaged on a common substrate
AssigneeMarvell Asia Pte Ltd
InventorsCarl E. Benes, Meenakshi Upadhyaya, Joshua F. Dillon, Andrew Killorin, Eric William Tremble, Wolfgang Sauter
Life of this patent
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Abstract
An electronic device includes: (i) first and second integrated circuit (IC) dies co-located on a surface of a substrate in proximity to each other, (ii) a heat sink disposed on the first and second IC dies, and (iii) a lid, which is disposed between the first IC die and the heat sink, and the lid is not disposed between the second IC die and the heat sink.
Claims20
An electronic device, comprising:
- first and second integrated circuit (IC) dies co-located on a surface of a substrate in proximity to each other;
- a heat sink disposed on the first and second IC dies;
- and
- a lid, which is disposed between the first IC die and the heat sink, and the lid is not disposed between the second IC die and the heat sink.
1 more element
A method for fabricating an electronic device, the method comprising:
- disposing, on a surface of a substrate, first and second integrated circuit (IC) dies co-located on the surface in proximity to each other;
- disposing a heat sink on the first and second IC dies;
- and
- disposing, between the first IC die and the heat sink, a lid, which is not disposed between the second IC die and the heat sink.
1 more element
Dependencies are inferred from the claim text.