Circuit board assembly and method

Abstract

A circuit board assembly, which includes an insert, a printed circuit board (PCB), the insert connected to the PCB, at least one semiconductor device, a primary connection between the insert and the semiconductor device, and a secondary connection between the insert and the semiconductor device. The secondary connection provides electrical and thermal communication between the semiconductor device and the insert when the primary connection fails. The primary connection between the insert and the semiconductor device is a sintered connection. The insert and the semiconductor device are in electrical and thermal communication with one another through the sintered connection. The sintered connection includes a sintering compound which connects the insert and the semiconductor device. The secondary connection includes a limp-home function if the primary connection fails.

Dependencies are inferred from the claim text.