Semiconductor module and method for manufacturing semiconductor module

A method for manufacturing a semiconductor module, comprising:

• providing a laminated substrate;
• providing multiple semiconductor chips on the laminated substrate;
• connecting the multiple semiconductor chips to a bonding wire;
• accommodating the multiple semiconductor chips, the bonding wire, and the laminated substrate inside a housing;
• filling a first encapsulation layer inside the housing such that the multiple semiconductor chips, the bonding wire, and the laminated substrate will be covered;
• filling a second encapsulation layer such that a top of the first encapsulation layer will be covered;
• and
• filling a third encapsulation layer such that a top of the second encapsulation layer will be covered, wherein
• the first encapsulation layer is filled inside the housing up to a position higher than an upper surface of the bonding wire, and
• hardness of the second encapsulation layer is greater than hardness of the first encapsulation layer, and less than hardness of the third encapsulation layer.