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OwnerAnshul Gupta, Zsolt Tokei +3inventors
InventorsAnshul Gupta, Zsolt Tokei, Stefan Decoster, Gayle Murdoch, Seongho Park
Estimating the term…
Methods and systems for producing an interconnect via are provided. A conductive layer is produced on a substrate having an upper surface of a dielectric material with conductors or contacts embedded in the dielectric material. A dielectric layer is produced on the conductive layer. An opening is formed in the dielectric layer and filled with a conductive material to form a conductive via. The dielectric layer and the via are planarized to a common planar level. At least one hardmask line which overlaps the via is formed. The dielectric material and the conductive material of the via and of the conductive layer are removed in the areas not covered by the hardmask line, resulting in a conductive line having an interconnect via on its top surface. The interconnect via is aligned to the width of the conductive line. The hardmask line is removed and a planar dielectric surface is produced.
A method for producing an interconnect via for connecting a lower electrically conductive line in a first level of a multi-level interconnect structure to an upper electrically conductive line in a second level overlying the first level, the method comprising the steps of:
An interconnect via for connecting a lower electrically conductive line in a first level of a multi-level interconnect structure to an upper electrically conductive line in a second level overlying the first level, the interconnect via comprising:
Dependencies are inferred from the claim text.