Determining substrate decentering in semiconductor processing systems employed to deposit material layers onto substrates

A material layer deposition method, comprising:

• at a semiconductor processing system including a chamber body, a substrate support arranged within an interior of the chamber body and supported for rotation about a rotation axis, a pyrometer supported above the chamber body that is radially offset from the rotation axis and optically coupled to the interior of the chamber body, and a controller operably connected to the substrate support and disposed in communication with the pyrometer,
• seating a substrate on the substrate support;
• acquiring a temperature measurement acquired using electromagnetic radiation emitted by the substrate;
• and
• determining decentering of the substrate relative to the rotation axis using the electromagnetic radiation received at the pyrometer.

A computer program product, comprising:

• a non-transitory machine-readable medium having a plurality of program modules recorded on the medium that, when read by a controller, cause the controller to:
• seat a substrate on a substrate support operably associated with the controller, the substrate support arranged within an interior of a chamber body and supported for rotation about a rotation axis;
• acquire a temperature measurement with a pyrometer disposed in communication with the controller, the pyrometer supported above the chamber body using electromagnetic radiation emitted by the substrate, the pyrometer radially offset from the rotation axis and optically coupled to the interior of the chamber body;
• and
• determine decentering of the substrate relative to the rotation axis using the electromagnetic radiation received by the pyrometer.