Methods of analyzing uniformity, and related apparatus and systems, for semiconductor manufacturing
AssigneeApplied Materials, Inc.
InventorsKim Ramkumar VELLORE, Tetsuya ISHIKAWA, Ala MORADIAN
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AssigneeApplied Materials, Inc.
InventorsKim Ramkumar VELLORE, Tetsuya ISHIKAWA, Ala MORADIAN
Estimating the term…
The present disclosure relates to methods of analyzing uniformity for substrate processing, and related apparatus and systems, for semiconductor manufacturing. In one or more embodiments, a non-uniformity is indicated, and the non-uniformity is a temperature non-uniformity and/or a physical non-uniformity. In one or more embodiments, a signal profile is accepted or rejected. In one or more embodiments, a method of analyzing uniformity for substrate processing applicable for semiconductor manufacturing includes heating an internal volume of a processing chamber using a target value. The method includes rotating a substrate support, and scanning, while rotating the substrate support, a sensor across one or more sections to take a plurality of readings. The method includes generating a signal profile including the plurality of readings, and analyzing the signal profile by comparing the signal profile to a range.
A method of analyzing uniformity for substrate processing applicable for semiconductor manufacturing, the method comprising:
A non-transitory computer readable medium applicable for semiconductor manufacturing, the non-transitory computer readable medium comprising instructions that when executed cause a plurality of operations to be conducted, the plurality of operations comprising:
A system for processing substrates and applicable for semiconductor manufacturing, the system comprising:
Dependencies are inferred from the claim text.