Back to results
US 2025/0029844 A1Published application
Copper features and related methods of forming
AssigneeSemiconductor Components Industries, LLC
InventorMichael J. SEDDON
Life of this patent
Estimating the term…
Abstract
Implementations of a method of forming a copper feature may include providing a copper layer with a thickness thicker than 1 mm; cutting a trench partially through the thickness leaving a remaining thickness using a laser; and, after cutting, removing the remaining thickness using a water jet.
Claims20
A method of forming a copper feature comprising:
- providing a copper layer with a thickness thicker than 1 mm;
- cutting a trench partially through the thickness leaving a remaining thickness using a laser;
- and
- after cutting, removing the remaining thickness using a water jet.
1 more element
A method of forming a copper feature comprising:
- providing a copper layer with a thickness thicker than 1 mm;
- cutting a trench partially through the thickness leaving a remaining thickness using a water jet;
- and
- after cutting, etching through the remaining thickness.
1 more element
A method of forming an insulated copper feature comprising:
- providing a copper layer comprising a thickness;
- forming a plurality of trenches through the thickness;
- and
- permanently filling the plurality of trenches with at least one polymer material immediately after forming the plurality of trenches.
1 more element
Dependencies are inferred from the claim text.