Semiconductor Molding System and Foreign Object Detection Method
AssigneesDiodes Incorporated, Shanghai Kaihong Technology Co., Ltd., Diodes Technology (Chengdu) Company Limited, Shanghai Kaihong Electronic Company Limited
InventorsDesen Wang, Zhigang Feng
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Abstract
A semiconductor molding system is provided that includes a molding device, an image collection device, and a controller connected to the molding device and the image collection device. The image collection device is configured to obtain a target image of a to-be-molded lead frame before the to-be-molded lead frame is molded by the molding device. The controller is configured to determine whether foreign object(s) exist in a non-molding area of the to-be-molded lead frame based on the target image of the to-be-molded lead frame and a reference image. A method for detecting foreign objects of a to-be-molded lead frame is also provided.
Claims20
A semiconductor molding system, comprising:
- a molding device;
- an image collection device, configured to obtain a target image of a to-be-molded lead frame before the to-be-molded lead frame is molded by the molding device;
- and
- a controller coupled to the molding device and the image collection device, the controller being configured to determine whether foreign object(s) exist in a non-molding area of the to-be-molded lead frame based on the target image of the to-be-molded lead frame and a reference image.
A method comprising:
- obtaining a target image of a to-be-molded lead frame before the to-be-molded lead frame is molded by a molding device;
- and
- determining whether foreign object(s) exist in a non-molding area of the to-be-molded lead frame based on the target image of the to-be-molded lead frame and a reference image configured for the to-be-molded lead frame.
An apparatus comprising:
- a molding device configured to mold lead frames;
- a foreign object detection device comprising an image collection device and a controller, wherein the image collection device is configured to obtain a target image of a to-be-molded lead frame arranged in the molding device, and the controller is configured to pre-set a reference image for the to-be-molded lead frame, and to compare the target image and the reference image to determine whether foreign object(s) exist in a non-molding area of the to-be-molded lead frame;
- and
- an alarm device connected to the controller, the alarm device being configured to, when there is a foreign object in the non-molding area, issue an alarm message upon receiving an instruction from the controller.
Dependencies are inferred from the claim text.