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US 2025/0028448 A1Published application
Data throughput using tcm
AssigneeMicron Technology, Inc.
InventorsKyle J. Wilkins, Suresh Reddy Yarragunta, Deepu Narasimiah Subhash, Koneri Sathyanarayana Guptha Amith
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Abstract
Aspects of the present disclosure configure a memory sub-system processor to use a thermally conductive material (TCM) to improve thermal energy storage and heat dissipation to improve a data transfer rate. The TCM surrounds the set of memory components and the processing device and is configured to dissipate heat from the processing device and the set of memory components.
Claims20
A system comprising:
- a set of memory components of a memory sub-system;
- a processing device operatively coupled to the set of memory components;
- and
- a thermally conductive material (TCM) surrounding the set of memory components and the processing device, the TCM configured to dissipate heat from the processing device and the set of memory components, wherein the processing device is configured to perform operations comprising:
- measuring temperature of at least one of the processing device or the set of memory components;
- accessing a reference temperature for controlling a data transfer rate between a host and the set of memory components;
- comparing the measured temperature with the reference temperature;
- and
- adjusting the data transfer rate based on the comparing the measured temperature with the reference temperature.
6 more elements
A method comprising:
- measuring temperature of at least one of a processing device or a set of memory components, wherein heat associated with the at least one of the processing device or the set of memory components is dissipated at least in part through a thermally conductive material (TCM) that surrounds the set of memory components and the processing device;
- accessing a reference temperature for controlling a data transfer rate between a host and the set of memory components;
- comparing the measured temperature with the reference temperature;
- and
- adjusting the data transfer rate based on the comparing the measured temperature with the reference temperature.
2 more elements
A method of manufacturing a printed circuit board (PCB) comprising a memory system, the method comprising:
- placing a processing device on a first portion of the PCB;
- placing a set of memory components of the memory system on a second portion of the PCB;
- and
- depositing thermally conductive material (TCM) on the PCB to surround the set of memory components and the processing device.
1 more element
Dependencies are inferred from the claim text.