Bonding method, bonding apparatus and article manufacturing method

A bonding apparatus that conveys a plurality of carriers and a plurality of substrates and bonds a first object and a second object, the plurality of carriers each holding a plurality of first objects, the plurality of substrates each having a plurality of second objects formed thereon, the apparatus comprising:

• an obtainment unit configured to obtain rank information including data indicating ranks of the respective first objects for each of the plurality of carriers and data indicating ranks of the respective second objects for each of the plurality of substrates;
• a deciding unit configured to decide, based on the rank information, a conveyance order of the plurality of carriers and a conveyance order of the plurality of substrates;
• and
• a bonding unit configured to convey the plurality of carriers and the plurality of substrates to the apparatus in accordance with the conveyance orders decided by the decision unit, and bond the first object and the second object.