Substrate treatment system and substrate treatment method
AssigneeTokyo Electron Limited
InventorKeiichi YAHATA
Life of this patent
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Abstract
A substrate treatment system connected to an exposure apparatus, includes: a substrate treatment apparatus configured to perform a treatment on a substrate; and a supply apparatus configured to supply atmosphere gas during a substrate treatment to the substrate treatment apparatus, wherein: the supply apparatus includes an intake part configured to take in emission gas emitted from the exposure apparatus; and the supply apparatus regulates a temperature and/or a humidity of the emission gas taken in from the intake part and then supplies the emission gas as the atmosphere gas to the substrate treatment apparatus.
Claims10
A substrate treatment system connected to an exposure apparatus, the substrate treatment system comprising:
- a substrate treatment apparatus configured to perform a treatment on a substrate;
- and
- a supply apparatus configured to supply atmosphere gas during a substrate treatment to the substrate treatment apparatus, wherein:
- the supply apparatus includes an intake part configured to take in emission gas emitted from the exposure apparatus;
- and
- the supply apparatus regulates a temperature and/or a humidity of the emission gas taken in from the intake part and then supplies the emission gas as the atmosphere gas to the substrate treatment apparatus.
A substrate treatment method using a substrate treatment system connected to an exposure apparatus, the method comprising
- regulating a temperature and/or a humidity of emission gas emitted from the exposure apparatus, and then supplying the emission gas as atmosphere gas to a substrate treatment apparatus of the substrate treatment system.
Dependencies are inferred from the claim text.