Electro-optical device via arrangement

An electro-optical device comprising:

• a planar first substrate,
• a first electric contact point on a first side of the first substrate,
• a second electric contact point on a second side of the first substrate,
• a first via arrangement configured to provide electric contact between the first electric contact point and the second electric contact point, wherein the first via arrangement comprises a first fiber optic portion and a first electrically conductive portion, and the first electrically conductive portion is
• attached to the first fiber optic portion,
• arranged between the first fiber optic portion and the first substrate and configured to electrically connect the first electric contact point and the second electric contact point when the first via arrangement is in a via of the first substrate, and
• unitary and extends on both sides of the first substrate when the first via arrangement is in a via of the first substrate,
• a second substrate on a second side of the first substrate,
• a first photonic device on the second substrate, wherein the first fiber optic portion is adapted to extend towards the first photonic device or connect the first photonic device for illumination or light coupling to or from the first photonic device,
• a second via arrangement configured to provide electric contact between a third electric contact point on the first side of the first substrate and a fourth electric contact point on the second side of the first substrate, wherein the second via arrangement comprises a second fiber optic portion and a second electrically conductive portion, and
• a second photonic device between the first substrate and the second substrate, wherein the second photonic device is hybridly integrated to the first substrate and electrically and optically connected to the second via arrangement.