Data signal transmission connector and manufacturing method for the same
AssigneeTse Co., Ltd.
InventorsBo Hyun KIM, Dae Hyun RO
Life of this patent
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Abstract
A signal transmission connector formed by fastening the lower cover in a state where conductive electrodes supported by cover holes of the lower cover are inserted into frame holes of the upper frame to which the ball guide film is attached. The conductive electrodes may be replaced individually, and the conductive electrodes can operate independently. There is provided a rubber socket type signal transmission connector, which is advantageous for high-speed signal transmission.
Claims10
A signal transmission connector for performing an electrical test of a device under test by connecting terminals of the device under test to pads of a tester generating a test signal, the signal transmission connector comprising:
- an upper frame through which frame holes are formed in a thickness direction at positions corresponding to the terminals of the device under test;
- a plurality of conductive electrodes, each of which is composed of plural conductive particles contained in an elastic insulating material, and includes an electrode body with an outer diameter smaller than that of the frame hole, and an electrode bump connected to the electrode body and having an outer diameter smaller than that of the electrode body;
- a ball guide film coupled to an upper side of the upper frame and provided with guide holes having an outer diameter smaller than that of the electrode body at positions corresponding to the frame holes;
- and
- a lower cover coupled to a lower side of the upper frame and provided with cover holes having an outer diameter smaller than that of the electrode body and larger than that of the electrode bump at centers of positions corresponding to the frame holes,
- wherein the lower cover is detachably coupled to the upper frame in a manner that the electrode body connected to the terminal of the device under test is disposed in the frame hole and the electrode bump connected to the pad of the tester is disposed in the cover hole.
A method of manufacturing a signal transmission connector for performing an electrical test of a device under test, the method comprising:
- preparing a bump mold in which a plurality of bump mold holes are formed, and stacking a body mold in which body mold holes having an outer diameter larger than that of the bump mold hole are formed at positions corresponding to the bump mold holes, above the bump mold;
- filling the bump mold holes and the body mold holes with a conductive particle mixture containing conductive particles in an elastic insulating material, and curing the conductive particle mixture;
- removing the bump mold to prepare an electrode mold in which multiple conductive electrodes, each having an electrode body and an electrode bump, are disposed on the body mold;
- preparing an upper frame by forming frame holes penetrating the upper frame in a thickness direction;
- attaching a ball guide film in which guide holes having an outer diameter smaller than that of the electrode body are formed at positions corresponding to the frame holes, to an upper side of the upper frame;
- turning over the upper frame in a manner that the ball guide film is located on a lower side, and arranging shims on an upper side of the upper frame;
- turning over the electrode mold to arrange the conductive electrodes at positions corresponding to the frame holes;
- disposing the conductive electrodes in the frame holes by pressing the conductive electrodes;
- and
- fastening a lower cover in which cover holes having an outer diameter smaller than that of the electrode body and larger than that of the electrode bump are formed at positions corresponding to the frame holes, to an upper side of the flipped upper frame.
Dependencies are inferred from the claim text.