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US 2025/0026912 A1Published application
Liquid composition, prepreg, metal substrate with resin, and wiring board
AssigneesAGC Inc., Agc Si-Tech Co., Ltd.
InventorHiromichi KAMO
Life of this patent
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Abstract
A liquid composition containing a thermosetting resin, first silica particles, second silica particles, and a solvent, in which the first silica particles have a median diameter d50 of from 1.5 μm to 20.0 μm, the product of a specific surface area and the median diameter d50 being from 2.7 to 5.0 μm m2/g, and the second silica particles have a median diameter d50 of from 0.3 μm to less than 1.5 μm; and a prepreg, a metal substrate with a resin, and a wiring board using the same are provided.
Claims15
A liquid composition, comprising:
- a thermosetting resin;
- first silica particles;
- second silica particles;
- and
- a solvent, wherein:
- the first silica particles have a median diameter d50 of from 1.5 μm to 20.0 μm, a product of a specific surface area of the first silica particles and the median diameter d50 being from 2.7 to 5.0 μm m2/g;
- and
- the second silica particles have a median diameter d50 of from 0.3 μm to less than 1.5 μm.
5 more elements
Dependencies are inferred from the claim text.