Chemical mechanical polishing (cmp) apparatus

A chemical mechanical polishing apparatus comprising:

• a substrate support plate configured to support a substrate;
• a rotation member positioned on the substrate support plate;
• a polishing pad connected to the rotation member and disposed between the rotation member and the substrate support plate;
• and
• a jig member positioned above the substrate support plate and movably connected to the rotation member,
• wherein the rotation member includes a slurry supplier positioned on the polishing pad and configured to include a slurry supply valve positioned to surround the polishing pad, and
• the slurry supply valve includes at least one nozzle for directly supplying slurry onto the substrate.

A chemical mechanical polishing apparatus comprising:

• a substrate support plate configured to fix a substrate by providing pressure to the substrate;
• a rotation member including a polishing pad support plate, a polishing pad attached to the polishing pad support plate, a polishing pad driver configured to rotate the polishing pad and the polishing pad support plate, and a slurry supplier positioned to extend through the polishing pad;
• and
• a jig member including
• a first jig member connected to the rotation member, and
• a second jig member in contact with the first jig member.