Monitoring mechanism, application thereof, and slicing machine with the monitoring mechanism

Abstract

A monitoring mechanism at least includes a monitoring unit, the monitoring unit is disposed in a slicing chamber and is configured to continuously monitor a state of a wire mesh and have no contact with the wire mesh. The monitoring mechanism of the present disclosure can continuously monitor the state of the wire mesh in the slicing chamber, especially accurately and timely track and monitor in a location of wire mesh nonstop in a non-contact way in a darkroom with serious vapor and a lot of silicon mud during slicing, which provides a solid foundation for precise determination of an abnormal wire mesh. The entire structure occupies a small space in the limited slicing chamber, and the structure is simple and safe such that data of the state of the wire mesh can be obtained timely accurately to prevent a risk of missing or wrong determination.

Dependencies are inferred from the claim text.