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US 2025/0025923 A1Published application
Substrate processing apparatus including nozzle unit and substrate processing method
AssigneeSemes Co., Ltd.
InventorsJu Hwan LEE, Hyeon Jun LEE, So Young PARK, Myung A JEON
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Abstract
Proposed are a substrate processing apparatus having improved substrate drying performance by separately providing a chemical liquid supply nozzle and a gas supply nozzle; and a substrate processing method.
Claims14
A nozzle unit comprising:
- a first nozzle configured to eject a liquid onto a substrate;
- a first actuating module configured to move the first nozzle;
- a second nozzle configured to eject a gas onto the substrate;
- and
- a second actuating module configured to be controlled independently of the first actuating module and configured to move the second nozzle,
- wherein the second nozzle is located closer to a center of the substrate than the first nozzle.
3 more elements
A substrate processing apparatus comprising:
- a substrate support unit configured to support a substrate;
- and
- a fluid supply unit comprising a nozzle unit configured to supply a processing fluid onto the substrate supported by the substrate support unit,
- wherein the nozzle unit comprises:
- a first nozzle configured to eject a cleaning liquid onto the substrate;
- a first actuating module configured to move the first nozzle;
- a second nozzle configured to eject an inert gas onto the substrate to dry the substrate;
- a second actuating module configured to move the second nozzle;
- and
- an actuating controller configured to independently control the first actuating module and the second actuating module to determine positions of the first nozzle and the second nozzle,
- wherein the second nozzle is located closer to a center of the substrate than the first nozzle.
8 more elements
Dependencies are inferred from the claim text.