Flow rate adjustment method in substrate processing apparatus and substrate processing apparatus

A substrate processing apparatus comprising:

• a plurality of liquid processors configured to perform liquid processing by supplying a mixed liquid of sulfuric acid and hydrogen peroxide to a substrate;
• a temperature sensor provided in each of the plurality of liquid processors and configured to measure a temperature of the mixed liquid;
• and
• a controller,
• wherein the controller is configured to cause each part to execute a flow rate adjustment method including:
• discharging the mixed liquid under a plurality of discharge conditions from a first liquid processor and a second liquid processor selected from among the plurality of liquid processors;
• measuring the temperature of the mixed liquid for each of the plurality of discharge conditions by using the temperature sensor provided in each of the first liquid processor and the second liquid processor;
• obtaining, based on the measured temperature of the mixed liquid, a correlation function between the temperature of the mixed liquid and a flow rate of sulfuric acid included in each of the plurality of discharge conditions for each of the first liquid processor and the second liquid processor, and generating, based on the correlation function, a relational expression illustrating a sulfuric acid flow rate relationship when the temperature of the mixed liquid is identical between the first liquid processor and the second liquid processor;
• and
• adjusting the flow rate of sulfuric acid before being mixed into the mixed liquid in the second liquid processor by using the relational expression.