Hollow particles, resin composition, and resin molded body

Abstract

To provide hollow particles configured to be low in dielectric dissipation factor at high frequencies. Hollow particles which comprise a shell containing a resin and a hollow portion surrounded by the shell, wherein a void ratio of the hollow particles is 50% or more; wherein, as the resin, the shell contains a polymer which contains 91% by mass or more of hydrocarbon monomer units and 50% by mass or more of crosslinkable monomer units; wherein at least a part of the hydrocarbon monomer units are crosslinkable hydrocarbon monomer units; wherein a residual double bond ratio of the polymer is 30.0% or less; and wherein a dielectric dissipation factor of the hollow particles at a frequency of 10 GHz is 3.00×10−3 or less.

Dependencies are inferred from the claim text.