Method to relieve stress in capsule shells to reduce propensity to break
AssigneeR.P. Scherer Technologies, LLC
InventorsLester David Fulper, Norton Hart
Life of this patent
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Abstract
A method of treating a hard capsule shell to reduce or alleviate stress or reduce the propensity for cracking in the capsule shell. The method includes a step of heating at least a portion of the hard capsule shell to a temperature above a glass transition temperature of the capsule shell but below a melt temperature of the hard capsule shell for a time sufficient to reduce internal stress in the hard capsule shell. The method can be used to reduce cracking of hard capsule shells by application of the heat treatment to the filled capsule shells after fabrication and filling.
Claims20
A method to reduce the propensity of cracking in a completed hard capsule shell that encapsules a hygroscopic fill, comprising a step of:
- heating a portion of the completed hard capsule shell to a temperature above a glass transition temperature of the completed capsule shell but 2° C.-10° C. below a melt temperature of the completed hard capsule shell,
- wherein the completed hard capsule shell comprises gelatin and has a weight ratio of plasticizer to polymer of from 0 to 0.25.
A method of treating a completed hard capsule shell that encapsules a hygroscopic fill, comprising a step of:
- heating a portion of the completed hard capsule shell to a temperature above a glass transition temperature of the completed capsule shell but 2° C.-10° C. below a melt temperature of the completed hard capsule shell,
- wherein the completed hard capsule shell comprises gelatin and has a weight ratio of plasticizer to polymer of from 0 to 0.25.
Dependencies are inferred from the claim text.