Plasma processing apparatus, substrate processing apparatus, and temperature control system

A substrate processing apparatus, comprising:

• a chamber;
• a substrate support that is disposed in the chamber and includes an internal flow path;
• a first chiller configured to maintain a first temperature-controlled fluid at a first temperature;
• a second chiller configured to maintain a second temperature-controlled fluid at a second temperature;
• multiple valves;
• a controller that is configured to perform switching of the multiple valves, and includes a processor and a memory storing one or more programs, which when executed, cause the processor to:
• control the multiple valves, in a first mode, so as to establish a first supply line that circulates the first temperature-controlled fluid between the internal flow path and the first chiller, and establish a first circulation line that circulates the second temperature-controlled fluid between at least one of the multiple valves and the second chiller, and
• control the multiple valves, in a second mode, so as to establish a second circulation line that circulates the first temperature-controlled fluid between at least one of the multiple valves and the first chiller, and establish a second supply line that circulates the second temperature-controlled fluid between the internal flow path and the second chiller;
• and
• a thermoelectric element that is disposed
• between the first supply line and the first circulation line,
• between the second circulation line and the second supply line, or
• both between the first supply line and the first circulation line and between the second circulation line and the second supply line.

A temperature control system, comprising:

• a first temperature control line;
• a second temperature control line;
• a first temperature controller configured to maintain a temperature of a first temperature-controlled medium at a first temperature, the first temperature-controlled medium flowing through the first temperature control line;
• a second temperature controller configured to maintain a temperature of a second temperature-controlled medium at a second temperature, the second temperature-controlled medium flowing through the second temperature control line;
• and
• a thermoelectric element that is disposed between the first temperature control line and the second temperature control line.