Wafer transfer apparatus, vapor deposition system and method of operating the vapor deposition system

Abstract

Disclosed are a wafer transfer apparatus, a vapor deposition system, and a method of operating the vapor deposition system. The wafer transfer apparatus includes: a susceptor on which at least one holding element is provided, each holding element including at least two substrate holders, the each of the substrate holders being correspondingly provided with two linear grooves, the two linear grooves being oppositely disposed on a periphery of the each of the substrate holders, the substrate holders being configured to accommodate wafers, the linear grooves in a same holding element being parallel disposed; a transfer mechanism including a plurality of engaging fingers, the engaging fingers being configured to lift the wafers in the same holding element simultaneously via the linear grooves and handle the wafers to preset locations. The transfer mechanism disclosed may transfer at least two wafers at a time, whereby wafer handling and transfer efficiency can be effectively enhanced, while potential wafer contamination can be mitigated.

Dependencies are inferred from the claim text.