Semiconductor wafer carrier structure and metal-organic chemical vapor deposition device

A semiconductor wafer carrier structure, comprising:

• a carrier body having a surface;
• a protective film covering the surface;
• a susceptor disposed on the carrier body and having an upper surface, wherein the upper surface is a planar surface and is divided into a peripheral surface and a partial surface, the susceptor is provided with a plurality of supporting parts protruding from the peripheral surface and individually distributed around a perimeter of the susceptor, and the supporting parts are configured to support a semiconductor wafer;
• a passivation layer formed on the peripheral surface of the susceptor and the supporting parts and exposing the partial surface of the susceptor;
• and
• a patterned coating film formed on the partial surface of the susceptor and configured to directly face the semiconductor wafer, wherein a material of the patterned coating film is different from a material of the susceptor, the patterned coating film has two or more different thicknesses to form a pattern between the supporting parts, and a top of the supporting parts is higher than a top of the patterned coating film in a thickness direction of the susceptor, so that the semiconductor wafer is entirely separated from the pattern of the patterned coating film,
• wherein the passivation layer and the patterned coating film are continuously and entirely distributed on the upper surface of the susceptor toward the semiconductor wafer, and the upper surface of the susceptor is separated from the semiconductor wafer by the passivation layer and the patterned coating film.