Cleaning composition and method for manufacturing semiconductor substrate
AssigneeFUJIFILM Corporation
InventorsTetsuya KAMIMURA, Shimpei YAMADA
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Abstract
An object of the present invention is to provide a cleaning composition that suppresses a surface roughness of a region including Mo and has excellent removability of Mo-based residues in a case of being used in a treatment of an Mo-containing substrate. The cleaning composition of an embodiment of the present invention is a cleaning composition used in a treatment of a molybdenum-containing substrate, the cleaning composition including an organic acid and organic amine compounds having at least one group selected from the group consisting of a primary amino group, a secondary amino group, and a tertiary amino group, in which the cleaning composition includes two or more kinds of the organic amine compounds.
Claims20
A cleaning composition used in a treatment of a molybdenum-containing substrate, the cleaning composition comprising:
- an organic acid;
- and
- organic amine compounds having at least one group selected from the group consisting of a primary amino group, a secondary amino group, and a tertiary amino group,
- wherein the cleaning composition includes two or more kinds of the organic amine compounds.
Dependencies are inferred from the claim text.