Layered structure and use thereof
AssigneesPrime Polymer Co., Ltd., Sika Technology AG
InventorsYusuke FUKUDA, Shuichi TAKAHASHI, Yuichi MATSUKI, Megumi ABE, Kazuki MIURA, Akio IKEDA
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AssigneesPrime Polymer Co., Ltd., Sika Technology AG
InventorsYusuke FUKUDA, Shuichi TAKAHASHI, Yuichi MATSUKI, Megumi ABE, Kazuki MIURA, Akio IKEDA
Estimating the term…
The layered structure of the present invention is a layered structure formed by directly layering a resin cured layer (ii) containing a curable resin (E) having a urethane bond, on a molded body (i) composed of a polypropylene-based resin composition, wherein the polypropylene-based resin composition contains 5 to 47 parts by mass of a propylene-based polymer (A) having an MFR of 50 to 150 g/10 min, and an amount of a decane-soluble portion of 6 to 15% by mass, 20 to 30 parts by mass of a propylene homopolymer (B) having an MFR of 10 to 500 g/10 min, 23 to 30 parts by mass of an ethylene/α-olefin copolymer (C) being a random copolymer of ethylene and an α-olefin having 4 to 8 carbon atoms, and having a density of 0.850 to 0.880 g/cm3, an MFR of 0.5 to 30 g/10 min, and a melting point peak of 110° C. or more, and 30 to 40 parts by mass of an inorganic filler (D).
A layered structure formed by directly layering a resin cured layer (ii) comprising a curable resin (E) having a urethane bond, on a molded body (i) comprising a polypropylene-based resin composition,
A method for producing a layered structure, the method comprising:
Dependencies are inferred from the claim text.