Cover member, double-sided adhesive sheet, seal member, and sheet for supplying member

Abstract

A cover member suitable for suppressing damage to a semiconductor device package includes: a cover sheet having a shape configured to cover an object in a state of being placed on a placement face; and an adhesive layer joined to the cover sheet and configured to fix the cover member to the placement face. The adhesive layer includes a double-sided adhesive sheet. The double-sided adhesive sheet has a structure in which a first adhesive agent layer, a substrate, and a second adhesive agent layer are laminated in this order. The substrate has a porous structure. The substrate has a porosity of 30% or more. When the porosity of the substrate is 30% or more and 50% or less, the substrate has an average pore diameter of 10 μm or more, and when the porosity of the substrate is more than 50%, the average pore diameter is 0.05 μm or more.

Dependencies are inferred from the claim text.