Back to results
US 2025/0018624 A1Published application
Resin mold
AssigneeMitsubishi Electric Corporation
InventorsYasuyuki HARUI, Ryuki NAKAMURA
Life of this patent
Estimating the term…
Abstract
A resin molding mold of the present disclosure includes: a slide core slidably attached to a guide rail; and a sensor for detecting a force applied to the guide rail when the slide core slides.
Claims6
A resin molding mold comprising:
- a slide core slidably attached to a guide rail;
- and
- a sensor for detecting a force applied to the guide rail when the slide core slides.
Dependencies are inferred from the claim text.