Processing method for workpiece
AssigneeDisco Corporation
InventorsHayato KIUCHI, Chitose YAMADA
Life of this patent
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Abstract
A processing method for a workpiece is provided. The method includes preparing the workpiece by fixing a surface of the workpiece on one side to a support member, the workpiece having a division groove formed therein along a division preparatory line; reducing a width of the division groove by applying external force to at least a region of the support member corresponding to the division groove to cause shrinkage in the support member; and removing a burr from the workpiece by injecting high-pressure water along the division groove from the other side of the workpiece.
Claims2
A processing method for a workpiece, comprising:
- preparing the workpiece by fixing a surface of the workpiece on one side to a support member, the workpiece having a division groove formed therein along a division preparatory line;
- reducing a width of the division groove by applying external force to at least a region of the support member corresponding to the division groove to cause shrinkage in the support member;
- and
- removing a burr from the workpiece by injecting, after the support member being shrunk, high-pressure water along the division groove from the other side of the workpiece.
Dependencies are inferred from the claim text.