US 2025/0018527 A1 · WAFER POLISHING SYSTEM AND WAFER TRANSFER METHOD

Abstract

The invention discloses a wafer polishing system, which comprises polishing units. The polishing unit comprises a wafer transfer channel and polishing modules. The polishing module comprises a polishing platform and a polishing arm, and the polishing arm can drive wafers to move relative to the polishing platform. The wafer transfer channel is provided with at least two working positions, and a load port can move between the working positions. A delivery structure is arranged between adjacent polishing units, which transfers wafers between working positions of the adjacent polishing units along a first trajectory, and the first trajectory falls on the wafer transfer channel. The invention further discloses a wafer transfer method. The trajectories of this invention all fall within the wafer transfer channel, without occupying any additional space, thereby ensuring a reasonable layout. The process is flexible and highly efficient, and transfer stability is high.

Claims16

Dependent claims

A wafer polishing system, comprising polishing units;

wherein the polishing unit comprises a wafer transfer channel and polishing modules;
the polishing module comprises a polishing platform and a polishing arm, and the polishing arm is able to drive wafers to move relative to the polishing platform to realize a polishing process;
the wafer transfer channel is provided with at least two working positions, and a wafer load port is able to move between the working positions;
a delivery structure is arranged between adjacent polishing units, which transfers the wafers between working positions of the adjacent polishing units along a first trajectory, and the first trajectory falls on the wafer transfer channel;
and/or the wafer load port is able to move between the adjacent polishing units;
and/or a conveyance structure is arranged between the polishing unit and an external transfer station, which transfers the wafers between working positions of the polishing unit and the external transfer station along a second trajectory, and the second trajectory falls on the wafer transfer channel.

3 more elements

A wafer transfer method of a wafer polishing system, wherein the wafer polishing system comprises polishing units, the polishing unit comprises a wafer transfer channel, the wafer transfer channel is provided with at least two working positions, and a wafer load port is able to move between the working positions;

and the wafer transfer method comprises the following step:
transferring, by a delivery structure, wafers from the working position of one polishing unit to the working position of another adjacent polishing unit along a first trajectory, the first trajectory falling on the wafer transfer channel.

Dependencies are inferred from the claim text.

Wafer polishing system and wafer transfer method

Life of this patent

Wafer polishing system and wafer transfer method

Life of this patent

Abstract

Claims16