Chemical mechanical polishing apparatus
AssigneeDaikin Industries, Ltd.
InventorsYoshiaki HONDA, Daiki ISHII
Life of this patent
Estimating the term…
Abstract
A chemical mechanical polishing apparatus, including one or more components, where one or more of the components have a surface-treating layer formed using a fluoropolyether group-containing compound.
Claims8
A chemical mechanical polishing apparatus, comprising one or more components,
- wherein one or more of the components have a surface-treating layer formed using a fluoropolyether group-containing compound.
A method for treating a chemical mechanical polishing apparatus, the method comprising applying a surface-treating agent to a surface of one or more components of the chemical mechanical polishing apparatus to form a surface-treating layer, wherein the surface-treating agent comprises a fluoropolyether group-containing compound.
A surface-treating agent, comprising a fluoropolyether group-containing compound,
- wherein the surface-treating agent is used to form a surface-treating layer by being applied to a surface of one or more components comprised in the chemical mechanical polishing apparatus.
Dependencies are inferred from the claim text.