Polishing device, substrate treating apparatus, and polishing method
AssigneeSCREEN Holdings Co., Ltd.
InventorsHiroaki ISHII, Junichi ISHII
Life of this patent
Estimating the term…
Abstract
This disclosure relates to a polishing device, a substrate treating apparatus, and a polishing method. The polishing device includes a polishing unit 22. The polishing unit 22 includes a holding rotator 35 configured to rotate the substrate W while holding the substrate W in a horizontal posture, a hot plate 45 configured to heat the substrate W, and a polisher 96 having a resin body where abrasive grains are distributed and configured to polish a back face of the substrate W in a chemo-mechanical grinding manner by contacting against the back face of the substrate W that is rotated while being heated.
Claims10
A polishing device, comprising a polishing unit,
- the polishing unit including:
- a holding rotator configured to rotate a substrate while holding the substrate in a horizontal posture;
- a heating member configured to heat the substrate;
- and
- a polisher having a resin body where abrasive grains are distributed and configured to polish a back face of the substrate in a chemo-mechanical grinding manner by contacting against the back face of the substrate rotated while being heated.
A substrate treating apparatus for treating a substrate, comprising:
- a polishing device including a polishing unit,
- a the polishing unit including:
- a holding rotator configured to rotate a substrate while holding the substrate in a horizontal posture;
- a heating member configured to heat the substrate, and
- a polisher having a resin body where abrasive grains are distributed and configured to polish a back face of the substrate in a chemo-mechanical grinding manner by contacting against the back face of the substrate rotated while being heated.
A polishing method for polishing a back face of a substrate, the method comprising:
- a rotating step of rotating the substrate held in a horizontal posture by a holding rotator;
- a polishing step of polishing the back face of the substrate in a chemo-mechanical grinding manner by contacting a polisher against the back face of the substrate, the polisher having a resin body where abrasive grains are distributed;
- and
- a heating step of heating the substrate when polishing is performed.
Dependencies are inferred from the claim text.