Thermal interface material
OwnerYong Joon Lee, William J. Scimeca +2inventors
InventorsYong Joon Lee, William J. Scimeca, Nicolo Brambilla, Albrecht Becker
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Abstract
A thermal interface material that conducts heat is disclosed. The thermal interface includes a bulk layer and at least one adhesive layer. The bulk layer includes a first acrylic rubber, plasticizer particles, and first filler particles, and the first filler particles are substantially aligned in a first direction. The first adhesive layer is disposed on a first side of the bulk material. The first adhesive layer has a greater tackiness than the bulk material. The first adhesive layer comprises a second acrylic rubber. The first direction is substantially perpendicular to a first surface of the first side on which the first adhesive layer is disposed.
Claims56
A thermal interface material, comprising:
- a bulk layer, wherein:
- the bulk layer comprises a first acrylic rubber, plasticizer particles, and first filler particles;
- and
- the first filler particles are substantially aligned in a first direction;
- and at least one adhesive layer, comprising a first adhesive layer,
- wherein:
- the first adhesive layer is disposed on a first side of the bulk material;
- the first adhesive layer has a greater tackiness than the bulk material;
- the first adhesive layer comprises a second acrylic rubber;
- the first direction is perpendicular to a first surface of the first side on which the first adhesive layer is disposed.
Dependencies are inferred from the claim text.