Microchannel plate image intensifiers and methods of producing the same

A method of manufacturing an optoelectronic device, the method comprising:

• disposing a plurality of electron emitting photocathodes between a first wafer and a microchannel plate defining a plurality of microchannels extending therethrough;
• disposing a phosphorescent layer between the microchannel plate and a second wafer comprising an imaging array comprising a plurality of photodiodes, wherein the imaging array is configured to collect electrons from the microchannel plate and produce a digital image;
• and
• bonding the second wafer to the first wafer to form a plurality of vacuum cavities therebetween such that at least one of the electron emitting photocathodes, one or more of the microchannels, and at least a portion of the phosphorescent layer are disposed within each of the vacuum cavities.

A method of manufacturing an optoelectronic device, the method comprising:

• disposing a plurality of electron emitting photocathodes between a first substrate and a microchannel plate defining a plurality of microchannels extending therethrough;
• forming an imaging array in a second substrate comprising a plurality of photodiodes, wherein each of the photodiodes is aligned with at least one of the microchannels and the photodiodes are configured to collect electrons from the microchannel plate and produce a digital image;
• and
• bonding the second substrate to the first substrate to form a plurality of vacuum cavities therebetween such that at least one of the electron emitting photocathodes and one or more of the microchannels are disposed within each of the vacuum cavities.