Microcapsule-type curable resin composition
AssigneeThreebond Co., Ltd.
InventorTetsunori SOGA
Life of this patent
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AssigneeThreebond Co., Ltd.
InventorTetsunori SOGA
Estimating the term…
A microcapsule-type curable resin composition to be applied to a screwing member is capable of reducing the generation of crumbs when the screwing member is screwed into a base material, having excellent anti-loosening effect. A method for producing a screwing member, includes applying the microcapsule-type curable resin composition to a surface of a screwing member, and drying the composition to form a precoated adhesive layer. A screwing member has a precoated adhesive layer formed by applying the microcapsule-type curable resin composition to the surface of the screwing member and drying the composition. A microcapsule-type curable resin composition contains Component (A): an epoxy resin; Component (B): a water-dispersible binder; Component (C): a curing agent for an epoxy resin; and Component (D): a hollow filler.
A microcapsule-type curable resin composition comprising the following components (A) to (D):
Dependencies are inferred from the claim text.