Substrate processing method and substrate processing apparatus
AssigneeEbara Corporation
InventorMasayuki NAKANISHI
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Abstract
The present invention relates to a substrate processing apparatus for processing a substrate, such as a wafer, and more particularly to a substrate processing method and a substrate processing apparatus for polishing a bevel portion of the substrate and performing CMP processing of a flat portion of the substrate. The substrate processing method includes: polishing a bevel portion (B) of each of the plurality of substrates (W) by a polishing tool such that slope surfaces(S) of bevel portions (B) of the plurality of substrates (W) have the same slope angles (α); and performing CMP processing of a flat portion (P) of each of the plurality of substrates (W) whose bevel portions (B) have been polished.
Claims12
A substrate processing method of processing a plurality of substrates, comprising:
- polishing a bevel portion of each of the plurality of substrates by a polishing tool such that slope surfaces of bevel portions of the plurality of substrates have the same slope angles;
- and
- performing CMP processing of a flat portion of each of the plurality of substrates whose bevel portions have been polished.
A substrate processing apparatus for processing a plurality of substrates, comprising:
- a bevel-portion polishing module configured to press a polishing tool against a bevel portion of each of the plurality of substrates to polish the bevel portion;
- and
- a CMP module configured to perform CMP processing of a flat portion of each of the plurality of substrates whose bevel portions have been polished,
- wherein the bevel-portion polishing module is configured to polish the bevel portions of the plurality of substrates such that slope surfaces of the bevel portions of the plurality of substrates have the same slope angles.
Dependencies are inferred from the claim text.