Method of measuring physical properties, method of evaluating member, method of manufacturing electronic component device, method of manufacturing material for electronic component device, and physical property measurement system
AssigneeResonac Corporation
InventorHirokazu NOMA
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Abstract
A method of measuring physical properties includes: a preparation step of preparing a moisened member containing an organic material and having a known water absorption rate and a known mass; a heating and cooling step of performing cooling after heating the member; and a measurement step of measuring a mass of the member after cooling the member in the heating and cooling step, in which in the heating and cooling step, a deformation rate of the member is measured using a digital image correlation method.
Claims20
A method of measuring physical properties, the method comprising:
- preparing a moistened member containing an organic material and having a known water absorption rate and a known mass;
- heating and then cooling the member;
- and
- measuring a mass of the member while heating and cooling the member, after heating and cooling the member, or any combination thereof, and measuring a deformation rate of the member using a digital image correlation method.
A physical property measurement system, comprising:
- a temperature control chamber including an arrangement portion in which a moistened member containing an organic material and having a known water absorption rate and a known mass is arranged, and a temperature control unit that heats and cools the member arranged in the arrangement portion;
- a deformation rate measurement unit that measures a deformation rate of the member arranged in the arrangement portion using a digital image correlation method;
- and
- a mass measurement unit that measures a mass of the member.
Dependencies are inferred from the claim text.