US 2025/0001672 A1 · THERMOFORMING DEVICE

Abstract

A thermoforming device (1) is provided for performing a heating process of radiationally heating a resin film (4) to a predetermined temperature (C21) by a radiation heater (6) and a bonding process of bonding the radiationally heated resin film (4) to a pulp mold (10) set on a base (52). The thermoforming device (1) is provided with a vacuum pump (7) to evacuate a space between the pulp mold (10) and the resin film (4) to bring the resin film (4) to be in close contact with the pulp mold (10) in the bonding process. The radiation heater (6) is changeable in its distance to the resin film (4) between a first heating position to perform radiation heating of the resin film (4) in the heating process and a second heating position to perform radiation heating of the resin film (4) in the bonding process.

Claims5

Dependent claims

A thermoforming device comprising a radiation heater and a base provided to oppose the radiation heater with a resin film interposed therebetween, the thermoforming device being configured to perform:

heating of radiationally heating the resin film to a predetermined temperature by the radiation heater;
and bonding the resin film which has been radiationally heated to a fiber molding placed on the base, wherein
the thermoforming device is provided with a depressurizing member to evacuate a space between the fiber molding and the resin film to bring the resin film into close contact with the fiber molding in the bonding, and
the radiation heater is changeable in its distance to the resin film between a first heating position of radiationally heating the resin film in the heating and a second heating position of radiationally heating the resin film in the bonding.

1 more element

Dependencies are inferred from the claim text.

Thermoforming device

Life of this patent

Thermoforming device

Life of this patent

Abstract

Claims5