Packaging method and packaging device for pcba board
AssigneeKonig Electronic Technology Co., Ltd
InventorJianxiao ZHU
Life of this patent
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Abstract
The disclosure discloses a packaging method and a packaging device for a PCBA board. The PCBA board comprises a printed circuit board and an electronic element arranged on the printed circuit board; the maximum height of the electronic element relative to surface of the printed circuit board is less than 1 cm. The packaging method comprising: during glue spraying process, controlling a glue spraying assembly to spray UV glue liquid to a target spraying area of the PCBA board by moving back and forth in a straight line in a horizontal direction. The packaging method for a PCBA board provided by the present disclosure realizes packaging and protection of electronic components by spraying UV glue liquid to an area of the PCBA board that needs protection by the glue spraying assembly.
Claims16
1-20. (canceled)
A PCBA board packaging device, wherein the PCBA board packaging device comprises:
- a glue spraying assembly for spraying PCBA board packaging UV glue liquid;
- the glue spraying assembly has a glue spraying panel on which a plurality of parallel spraying hole rows are distributed;
- each spraying hole row has a plurality of spraying holes through which spraying is controlled independently that are arranged in a first direction;
- the PCBA board packaging device further comprises:
- a first moving assembly connected to the glue spraying assembly;
- the first moving assembly is used to drive the glue spraying assembly to move back and forth in a straight line in a horizontal direction;
- a working table located below the glue spraying assembly, the working table having a placement surface for placing a PCBA board;
- a control device connected to the glue spraying assembly and the first moving assembly, the control device capable of controlling the glue spraying assembly to spray UV glue liquid to a target spraying area of the PCBA board by moving back and forth in a straight line in a horizontal direction;
- the glue spraying assembly moves back and forth in a straight line at a height position higher than the highest electronic element;
- in the glue spraying process, the glue spraying assembly is not changed in height position during movement.
A PCBA board packaging method, wherein the PCBA board packaging method is implemented by a PCBA board packaging device, wherein the PCBA board packaging device comprises:
- a glue spraying assembly and a working table located below the glue spraying assembly;
- the glue spraying assembly is used for spraying PCBA board packaging UV glue liquid;
- the glue spraying assembly has a glue spraying panel on which a plurality of parallel spraying hole rows are distributed;
- each spraying hole row has a plurality of spraying holes through which spraying is controlled independently that are arranged in a first direction;
- the working table has a placement surface for placing a PCBA board;
- the packaging method comprises controlling the glue spraying assembly to spray UV glue liquid to a target spraying area of the PCBA board by moving back and forth in a straight line in a horizontal direction.
Dependencies are inferred from the claim text.