Multi-axis laser drilling for wafer-level packaging
AssigneeSTMicroelectronics International N.V.
InventorShei Meng LOO
Life of this patent
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Abstract
A method of relocation of input/output (I/O) contact pads in a wafer-level package is provided. A method of manufacturing a wafer-level package can include: forming a redistribution layer on a wafer having a contact pad disposed thereon, where the wafer defines a plane along a major horizontal surface on which the contact pad is disposed; drilling, with a multi-axis laser drill, a hole along an axis through the redistribution layer to reach the contact pad, where the axis of the hole through the redistribution layer is at an angle relative to the plane that is neither parallel nor orthogonal; and forming a contact extending from the contact pad, through the hole through the redistribution layer, to a position on the redistribution layer.
Claims20
A method of manufacturing a wafer-level package comprising:
- forming a redistribution layer on a wafer having a contact pad disposed thereon, wherein the wafer defines a plane along a major horizontal surface on which the contact pad is disposed;
- drilling, with a multi-axis laser drill, a hole along an axis through the redistribution layer to reach the contact pad, wherein the axis of the hole through the redistribution layer is at an angle relative to the plane that is neither parallel nor orthogonal;
- and
- forming a contact extending from the contact pad, through the hole through the redistribution layer, to a position on the redistribution layer opposite the wafer.
A wafer-level package comprising:
- a silicon wafer, wherein the silicon wafer defines a plane along a major horizontal surface;
- a contact pad on the major horizontal surface of the silicon wafer;
- a redistribution layer on the silicon wafer;
- a hole through the redistribution layer, wherein the hole defines an axis along which the hole extends, where the axis is at an angle relative to the plane of between about 10 degrees and 80 degrees;
- and
- a contact extending from the contact pad, through the hole through the redistribution layer, to a position on the redistribution layer opposite the silicon wafer.
A system for producing a wafer-level package comprising:
- a wafer having contact pads and a redistribution layer covering a major surface of the wafer and the contact pads;
- and
- a multi-axis laser drill, wherein the multi-axis laser drill is configured to drill holes at various different angles relative to a plane defined by the major surface of the wafer through the redistribution layer to reach at least one of the contact pads.
Dependencies are inferred from the claim text.