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US 2024/0426652 A1Published application
Microelectromechanical sensor assembly and process for manufacturing a microelectromechanical sensor assembly
AssigneeSTMicroelectronics International N.V.
InventorsGianluca LONGONI, Luca SEGHIZZI, Francesco BIANCHI, Federico VERCESI, Andrea NOMELLINI, Silvia NICOLI
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Abstract
A microelectromechanical sensor assembly includes a semiconductor die having a scaled cavity. A microelectromechanical inertial sensor has a sensing mass. A piezoelectric vibration sensor has a piezoelectric membrane. The sensing mass and the piezoelectric membrane are stacked one on top of the other and housed in the sealed cavity.
Claims15
A microelectromechanical sensor assembly, comprising:
- a semiconductor die having a sealed cavity;
- a microelectromechanical inertial sensor having a sensing mass;
- and
- a piezoelectric vibration sensor having a piezoelectric membrane;
- wherein the sensing mass and the piezoelectric membrane are housed in the sealed cavity.
2 more elements
A process for manufacturing a microelectromechanical sensor assembly, comprising:
- forming a semiconductor die having a sealed cavity;
- forming a microelectromechanical inertial sensor having a sensing mass;
- forming a piezoelectric vibration sensor having a piezoelectric membrane;
- and
- housing the sensing mass and the piezoelectric membrane in the sealed cavity.
2 more elements
Dependencies are inferred from the claim text.