Actively aligned and reflowable pluggable-connector for photonic integrated circuits

Abstract

Embodiments herein describe attaching (or bonding) alignment parts to a photonic die so that these alignment parts can then be used to passively align a FAU to the photonic die. In one embodiment, the alignment part (or parts) is aligned to a photonic die using a mounting FAU. The mounting FAU (along with the mated alignment parts) can then be actively aligned to the photonic die. When aligned, the alignment parts can be bonded (e.g., using cured epoxy) to the photonic die. The mounting FAU can then be lifted off, leaving the alignment parts attached to the photonic die. Later, a final product FAU (which may have a different shape than the mounting FAU) can then be passively aligned to the photonic die using the previously mounted alignment part or parts.

Dependencies are inferred from the claim text.