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US 2024/0418459 A1Published application
Lattice structures
AssigneeHewlett-Packard Development Company, L.P.
InventorsWei HUANG, Thomas Craig ANTHONY, Harish IRRINKI, Ben PON
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Abstract
Examples of lattice structures are described herein. In some examples, a heat exchanger may include a three-dimensional (3D) lattice structure. In some examples, the heat exchanger may include a spiral structure transecting the 3D lattice structure. In some examples, the spiral structure is to mix fluid to pass through the 3D lattice structure.
Claims15
A heat exchanger, comprising:
- a three-dimensional (3D) lattice structure;
- and
- a spiral structure transecting the 3D lattice structure, wherein the spiral structure is to mix fluid to pass through the 3D lattice structure.
An apparatus, comprising:
- a memory;
- a processor in electronic communication with the memory, wherein the processor is to:
- control a printhead to print a three-dimensional (3D) lattice structure;
- and
- control the printhead to print a flow exchange structure transecting the 3D lattice structure, wherein the flow exchange structure is to mix fluid to pass through the 3D lattice structure.
2 more elements
A method, comprising:
- determine a union between a geometrical representation of a three-dimensional (3D) lattice structure and a spiral structure;
- and
- print a heat exchanger by printing the union between the geometrical representation of the 3D lattice structure and the spiral structure, wherein the spiral structure transects the 3D lattice structure.
Dependencies are inferred from the claim text.