Tunable hexagonal boron carbon nitride heat spreader and method of adjusting its thermal and electrical conductivity

Abstract

A heat spreader composed of a hexagonal boron carbon nitride (hBCN) thin film, can be a major solution for the ever-increasing problem of overheating electronic devices. This heat spreader can dissipate heat away from hotspots on electronic devices, unlocking additional processing power. Our method is able to effectively tune the thermal and electrical conductivity of our films by modulating the carbon content of the precursor used in a chemical vapor deposition (CVD) process. Using this method, we can generate a heat spreader that is electrically insulative, so it will not have the potential to create shorts, like graphene and metals. Additionally, we can maximize the thermal conductivity, obtaining a value of 460±149 W/m·K, which rivals or even surpasses hexagonal boron nitride (hBN). As our precursor material is 10 times cheaper than the most common hBN precursor, this is an economical alternative to hBN for heat spreader applications.

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