Substrate inspection method
AssigneeSamsung Electronics Co., Ltd.
InventorsJinwoo Lee, Bumjoo Lee, Jong Cheon Sun, Suyoung Lee, Hyeongcheol Lee
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AssigneeSamsung Electronics Co., Ltd.
InventorsJinwoo Lee, Bumjoo Lee, Jong Cheon Sun, Suyoung Lee, Hyeongcheol Lee
Estimating the term…
A substrate inspection method includes reducing a surface potential of a substrate; and increasing a difference of the surface potential of the substrate, where reducing the surface potential of the substrate includes: controlling a scanning electron microscope to irradiate an electron beam to the substrate for a first irradiation time; and after a first standby time has elapsed, controlling the scanning electron microscope to re-irradiate the electron beam to the substrate for the first irradiation time, where increasing the difference of the surface potential of the substrate includes: controlling the scanning electron microscope to irradiate the electron beam to the substrate for a second irradiation time; and after a second standby time has elapsed, controlling the scanning electron microscope to re-irradiate the electron beam to the substrate for the second irradiation time, and where the first irradiation time is less than the second irradiation time.
A substrate inspection method, comprising:
A substrate inspection method, comprising:
A substrate inspection method, comprising:
Dependencies are inferred from the claim text.