Novel polymer, resin composition including same, and molded body thereof

Abstract

An object of the present invention is to provide a polymer that has excellent heat resistance and dielectric properties and can be dissolved in an organic solvent at a high concentration, a resin composition containing the same, and a molded body thereof. The polymer of the present invention has a repeating unit derived from a polymerizable compound of the following formula (I) (In the formula, X1 and X2 each independently represent a C3 to C6 branched alkyl group, a C3 to C6 cyclic alkyl group, a C3 to C6 branched alkoxy group, or a C3 to C6 cyclic alkoxy group, n represents 0 or 1, Z1 and Z2 each independently represent a single bond or a C1 to C3 alkylene group, each R independently represents an organic group or a halogeno group, m1 and m2 each independently represent any integer of 0 to 4, and Y represents a polymerizable functional group).

Dependencies are inferred from the claim text.