Bonding material composition, method for manufacturing bonding material composition, bonding film, method for manufacturing bonded body, and bonded body

Abstract

A bonding material composition that can improve the shear strength, heat resistance, electrical conductivity, and heat dissipation properties of a bonding layer, a method for manufacturing a bonding material composition, a bonding film, a method for manufacturing a bonded body, and a bonded body are provided. The bonding material composition according to the invention includes: metal particles (P) including first metal particles (P1) and second metal particles (P2); and a flux, in which the first metal particles (P1) are composed of a core (C1) made of Cu and a Cu2O layer covering the core (C1), and the second metal particles (P2) are composed of a core (C2) made of Cu, and Sn or Sn-containing solder covering the core (C2).

Dependencies are inferred from the claim text.