Display device and manufacturing method of display device
AssigneeJapan Display Inc.
InventorsNoriyuki HIRATA, Hirofumi MIZUKOSHI, Hiraaki KOKAME
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Abstract
According to one embodiment, a manufacturing method of a display device includes preparing a processing substrate by forming a lower electrode, forming an inorganic insulating layer, and forming a partition including a lower portion and an upper portion, forming an organic layer including a light emitting layer, forming an upper electrode, forming a cap layer, forming a first sealing layer, and forming a resin layer. The process of forming the organic layer, the upper electrode and the cap layer is an evaporation process using the partition as a mask in a vacuum environment. The process of forming the resin layer includes a process of applying a resinous material in an air atmosphere.
Claims20
A manufacturing method of a display device, comprising:
- preparing a processing substrate by forming a lower electrode above a substrate, forming an inorganic insulating layer having an aperture which overlaps the lower electrode, and forming a partition including a lower portion located on the inorganic insulating layer and an upper portion which is located on the lower portion and protrudes from a side surface of the lower portion;
- forming an organic layer including a light emitting layer on the lower electrode in the aperture;
- forming an upper electrode on the organic layer;
- forming a cap layer on the upper electrode;
- forming a first sealing layer which covers the cap layer and the partition;
- and
- forming a resin layer which covers the first sealing layer, wherein
- the process of forming the organic layer, the upper electrode and the cap layer is an evaporation process using the partition as a mask in a vacuum environment, and
- the process of forming the resin layer includes a process of applying a resinous material in an air atmosphere.
A display device comprising:
- a substrate;
- a lower electrode provided above the substrate;
- an inorganic insulating layer having an aperture which overlaps the lower electrode;
- an organic layer provided on the lower electrode in the aperture and including a light emitting layer;
- an upper electrode provided on the organic layer;
- a cap layer provided on the upper electrode;
- a partition which has a lower portion provided on the inorganic insulating layer, being in contact with the upper electrode and formed of a conductive material, and an upper portion provided on the lower portion and protruding from a side surface of the lower portion, and surrounds the organic layer, the upper electrode and the cap layer;
- and
- a first sealing layer which is provided on the cap layer surrounded by the partition, is in contact with the side surface of the partition and is formed of an inorganic insulating material, wherein
- the first sealing layer extends to an upper side of the partition and is spaced apart from the upper portion of the partition.
A manufacturing method of a display device, comprising:
- preparing a processing substrate by forming a lower electrode above a substrate, forming an inorganic insulating layer having an aperture which overlaps the lower electrode, and forming a partition which includes a lower portion located on the inorganic insulating layer and an upper portion located on the lower portion and protruding from a side surface of the lower portion;
- conveying the processing substrate to a first evaporation chamber, and forming an organic layer including a first light emitting layer on the lower electrode in the aperture;
- conveying the processing substrate without deposition of a material for forming a second light emitting layer which is different from the first light emitting layer in a second evaporation chamber for forming the second light emitting layer;
- conveying the processing substrate without deposition of a material for forming a third light emitting layer which is different from the first light emitting layer and the second light emitting layer in a third evaporation chamber for forming the third light emitting layer;
- forming an upper electrode on the organic layer;
- forming a cap layer on the upper electrode;
- forming a first sealing layer which covers the cap layer and the partition;
- and
- forming a resin layer which covers the first sealing layer, wherein
- the process of forming the resin layer includes a process of applying a resinous material in an air atmosphere.
Dependencies are inferred from the claim text.